Methods for Forming Dynamic Random-Access Devices by Implanting a Drain through a Spacer Opening at the Bottom of Angled Structures

ABSTRACT

Disclosed are DRAM devices and methods of forming DRAM devices. One method may include forming a plurality of trenches and angled structures, each angled structure including a first sidewall opposite a second sidewall, wherein the second sidewall extends over an adjacent trench. The method may include forming a spacer along a bottom surface of the trench, along the second sidewall, and along the first sidewall, wherein the spacer has an opening at a bottom portion of the first sidewall. The method may include forming a drain in each of the angled structures by performing an ion implant, which impacts the first sidewall through the opening at the bottom portion of the first sidewall. The method may include removing the spacer from the first sidewall, forming a bitline over the spacer along the bottom surface of each of the trenches, and forming a series of wordlines along the angled structures.

FIELD

The present embodiments relate to semiconductor substrates, and moreparticularly, to 4F² dynamic random-access devices and approaches forforming.

BACKGROUND

As dynamic random-access memory (DRAM) devices scale to smallerdimensions, an increasing emphasis is placed on patterning for formingthree dimensional structures, including trenches for storage nodes aswell as access transistors. In current DRAM devices, transistors may beformed using narrow and tall, vertical semiconductor fin structures,often made from monocrystalline silicon. In accordance with currenttrends, the aspect ratio of such fin structures, meaning the height(depth) of a fin divided by the spacing between adjacent fins, may reach20:1 or more in the coming years.

In an effort to continue scaling smaller, 4F² DRAM devices have beendeveloped. However, current 4F² DRAM devices have off-leakage currentissues for vertical channel transistors. The off-leakage current iscaused by the floating body effect caused by hole accumulation into thebody of the 4F² DRAM device. With respect to these and otherconsiderations, the present disclosure is provided.

SUMMARY OF THE DISCLOSURE

In view of the foregoing, what is needed are approaches for improvedremoval of the accumulated holes by laterally doping to a drain of theDRAM with high concentration. In some approaches, a method includesetching a substrate to form a plurality of trenches and a plurality ofangled structures, wherein each angled structure of the plurality ofangled structures includes a first sidewall opposite a second sidewall,and wherein the second sidewall extends over an adjacent trench of theplurality of trenches. The method may further include forming a spaceralong a bottom surface of the trench, along the second sidewall, andalong the first sidewall, wherein the spacer has an opening at a bottomportion of the first sidewall. The method may further include forming adrain in each of the plurality of angled structures by performing an ionimplant to the substrate, wherein the ion implant impacts the firstsidewall through the opening at the bottom portion of the firstsidewall. The method may further include removing the spacer from thefirst sidewall, forming a bitline over the spacer along the bottomsurface of each of the plurality of trenches, and forming a series ofwordlines along the plurality of angled structures.

In some approaches, a dynamic random-access memory (DRAM) device mayinclude a substrate including a plurality of trenches and a plurality ofangled structures, wherein each angled structure of the plurality ofangled structures includes a first sidewall opposite a second sidewall,and wherein the second sidewall extends over an adjacent trench of theplurality of trenches. The DRAM device may further include a drain ineach of the plurality of angled structures, a bitline over the spaceralong the bottom surface of each of the plurality of trenches, whereinthe second sidewall extends over bitline, and a series of wordlinesalong the plurality of angled structures.

In some approaches, a method of forming a dynamic random-access memory(DRAM) device may include etching a substrate to form a plurality oftrenches and a plurality of angled structures, wherein each angledstructure of the plurality of angled structures includes a firstsidewall opposite a second sidewall, and wherein the second sidewallextends over an adjacent trench of the plurality of trenches. The methodmay further include forming a spacer along a bottom surface of thetrench, along the second sidewall, and along the first sidewall, whereinthe spacer has an opening at a bottom portion of the first sidewall, andforming a drain in each of the plurality of angled structures byperforming an ion implant to the substrate, wherein the ion implantimpacts the first sidewall through the opening at the bottom portion ofthe first sidewall. The method may further include removing the spacerfrom the first sidewall, wherein the spacer remains along the bottomsurface and along the second sidewall, and forming a bitline over thespacer along the bottom surface of each of the plurality of trenches,wherein the second sidewall extends over the bitline. The method mayfurther include forming a source atop each of the plurality of angledstructures by performing a second implant to the plurality of angledstructures, and forming a series of wordlines along the plurality ofangled structures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a device including a substrate and aplurality of angled structures in accordance with embodiments of thepresent disclosure.

FIG. 2 is a perspective view of the device following an etch process inaccordance with embodiments of the present disclosure.

FIG. 3 is a perspective view of the device following a dielectric layerdeposition and recess process in accordance with embodiments of thepresent disclosure.

FIG. 4 is a perspective view of the device following removal of aportion of a spacer in accordance with embodiments of the presentdisclosure.

FIG. 5 is a perspective view of the device during an ion implant inaccordance with embodiments of the present disclosure.

FIG. 6 is a perspective view of the device after formation of aplurality of drains in accordance with embodiments of the presentdisclosure.

FIG. 7 is a perspective view of the device after removal of the spacerin accordance with embodiments of the present disclosure.

FIG. 8 is a perspective view of the device after a bitline depositionand recess process in accordance with embodiments of the presentdisclosure.

FIG. 9 is a perspective view of the device after a dielectric fill andplanarization process in accordance with embodiments of the presentdisclosure.

FIG. 10 is a perspective view of the device during a second ion implantin accordance with embodiments of the present disclosure.

FIG. 11 is a perspective view of the device after formation of aplurality of vertical structures and a second plurality of trenches inaccordance with embodiments of the present disclosure.

FIG. 12 is a perspective view of the device after a dielectric fill andlithography patterning and etch process to open a side of the wordlinein accordance with embodiments of the present disclosure.

FIG. 13 is a perspective view of the device after a wordline metaldeposition and recess process in accordance with embodiments of thepresent disclosure.

FIG. 14 is a perspective view of the device after dielectric removal inaccordance with embodiments of the present disclosure.

FIG. 15 is a side cross-sectional view of the device in accordance withembodiments of the present disclosure.

The drawings are not necessarily to scale. The drawings are merelyrepresentations, not intended to portray specific parameters of thedisclosure. The drawings are intended to depict exemplary embodiments ofthe disclosure, and therefore are not be considered as limiting inscope. In the drawings, like numbering represents like elements.

Furthermore, certain elements in some of the figures may be omitted, orillustrated not-to-scale, for illustrative clarity. The cross-sectionalviews may be in the form of “slices”, or “near-sighted” cross-sectionalviews, omitting certain background lines otherwise visible in a “true”cross-sectional view, for illustrative clarity. Furthermore, forclarity, some reference numbers may be omitted in certain drawings.

DETAILED DESCRIPTION

Methods and devices in accordance with the present disclosure will nowbe described more fully hereinafter with reference to the accompanyingdrawings, where embodiments of the methods are shown. The methods anddevices may be embodied in many different forms and are not to beconstrued as being limited to the embodiments set forth herein. Instead,these embodiments are provided so the disclosure will be thorough andcomplete, and will fully convey the scope of the system and method tothose skilled in the art.

The present embodiments provide novel devices and methods for formingsuch devices, such as transistors, formed from semiconductor finstructures. These approaches may be especially applicable to formationof DRAM devices, while other devices may also be formed according to theembodiments of the disclosure. Various non-limiting embodiments areparticularly useful for implementation where the width of fin structuresor pitch between fin structures is less than 50 nm, and in someembodiments, 20 nm or less. Embodiments herein provide new integrationsto effectively remove accumulated holes, which requires lateral dopingto drain with high concentration.

Turning now to FIG. 1, there is shown a device 100, such as a dynamicrandom-access memory (DRAM) device, according to embodiments of thedisclosure. The device 100 may include a plurality of angled structures102 separated by a plurality of trenches 104. The plurality of angledstructures 102 may be formed by etching a substrate 101, for example,using an angled ion etch. In exemplary embodiments, the plurality ofangled structures 102 may be an array of fin structures having a lengthextending along a first direction (such as parallel to the z-axis of theCartesian coordinate system shown), a height extending along a seconddirection (y-axis), and a width extending along a third direction(x-axis). According to various embodiments of the disclosure, the angledstructures 102 are monolithically formed with the same material as thesubstrate 101. As will be appreciated, the device 100 may be used tomake transistors and arrays of devices, such as DRAM arrays, havingsuperior properties, including more uniformity in performance betweendevices, higher device yield, and so forth.

As shown in FIG. 1, the device 100 may include a first spacer layer 108conformally formed over the substrate 101, including over all exposedsurfaces of the angled structures 102 and a bottom surface 109 of eachtrench 104. For example, the first spacer layer 108 may be depositedover a first sidewall 110 and a second sidewall 112 of each of theangled structures 102. As will be described in greater detail herein,each angled structure 102 is slanted or tilted (e.g., along the x-axis)so the second sidewall 112 extends partially or fully over an adjacenttrench 104.

Next, as shown in FIG. 2, the first spacer layer 108 may be removed fromthe angled structures 102, including from the first sidewall 110 andfrom a top surface 118 thereof. In some embodiments, the first spacerlayer 108 may be etched, for example, using a vertical reactive ion etch(RIE) process 120. Due to the angle of the angled structures 102extending over each trench 104, the first spacer layer 108 may not beremoved by the vertical RIE 120 from the bottom surface 109 of eachtrench 104 or from a base 122 between the first sidewall 110 and thebottom surface 109. As shown, a footing 124 of the first spacer layer108, which extends partially up the first sidewall 110, may remain inplace.

It will be appreciated that the presence and/or size of the footing 124may be influenced by the angle of the angled structures 102 and/or theangle of the RIE 120 relative to a perpendicular 126 extending normal toa plane defined by the bottom surface 109 of the trenches 104. Forexample, a larger/greater non-zero angle of incidence between the secondsidewall 112 and the perpendicular 126 means the angled structures 102extend farther over the trenches 104, thus preventing the vertical RIEfrom reaching more of the first spacer layer 108 along the trenches 104and the first sidewalls 110. As shown, the perpendicular 126 maygenerally be parallel to the y-axis.

As depicted in FIG. 3, a dielectric layer 130 may be formed over thefirst spacer layer 108 along the bottom surface 109 of each of thetrenches 104. In some embodiments, the dielectric layer 130 may bedeposited and then recessed to a desired depth/height. As shown, thedielectric layer 130 extends partially up the first and second sidewalls110, 112 to a point above the footing 124 of the first spacer layer 108.Although non-limiting, the dielectric layer 130 may be silicon oxide,nitride, or other type of film/material.

As shown in FIG. 4, a second spacer layer 132 may then be formed overthe angled structures 102. The second spacer layer 132 may extend alongthe first and second sidewalls 110, 112 to a top surface 134 of thedielectric layer 130. Once the dielectric layer 130 is removed, asdemonstrated in FIG. 5, an opening 135 at a bottom portion 136 of eachfirst sidewall 110 may be present. The opening 135 may separate thefooting 124 of the first spacer layer 108 from the second spacer layer132. A subsequent ion implant 140 to the device 100 will impact thefirst sidewalls 110 through each opening 135, resulting in a drain 142being formed in each angled structure 102, as shown in FIG. 6. The ionimplant 140 may be an epi plasma doping (PLAD) or beamline implant.

Although shown as a single implant, it will be appreciated that the ionimplant 140 may include a series of multiple implants. For example, insome non-limiting embodiments, the ion implant 140 may first include adeep phosphorous implant to isolate Pwell followed by boron implant forthe Pwell, e.g., for array access devices. A voltage for the boronimplant may then be raised to reduce row hammer, which is an issue seenin DRAM devices due to frequent turning on or off of adjacent cells,followed by a source/drain (S/D) P implant and a S/D As implant. Next, aGe implant into poly silicon may be performed to form a storage nodecontact, while also reducing interface resistance by amorphization. Ablanket P implant for NMOS may then be performed, wherein PMOS may becounter doped at a later stage. Finally, the device 100 may be heated,for example, by a 1000C rapid thermal anneal (RTA). In some non-limitingembodiments, the RTA may be performed for approximately 10 seconds in 1%02 to activate dopants.

Next, as shown in FIG. 7, the second spacer layer 132 may then beremoved from the first sidewalls 110 and from the top surfaces 118 ofeach angled structure 102. In some embodiments, the first spacer layer108 may remain atop the bottom surface 109 of each trench 104. Thefooting 124 of the first spacer layer 108 may be removed, however. Asshown in FIG. 8, a bitline 144 may be formed over the first spacer layer108 within each trench 104. In some embodiments, the bitline 144 may bea low resistance material, such as tungsten, titanium nitride, titanium,Ruthenium, Cobalt Molybdenum etc., which is deposited over the device100 and recessed to a desired thickness/height within the trenches 104.As shown, the bitline 144 may extend partially up the first and secondsidewalls 110, 112. However, a portion of each drain 142 may remainuncovered by the bitline 144 in some embodiments. Furthermore, a portionof the first spacer layer 108 remains exposed along the second sidewalls112.

As shown in FIG. 9, a first dielectric 148 may be deposited over thedevice 100, including over the bitline 144 within each of the trenches104 (FIG. 8). The first dielectric 148 may then be planarized to adesired height, for example, planar or substantially planar with the topsurface 118 of the angled structures 102. A second ion implant 150 maythen be performed to form a source layer 152 atop each of the angledstructures 102, as shown in FIG. 10. In some embodiments, the second ionimplant 150 may be a low-dose source/drain Phosphorous or Arsenicimplant.

As shown in FIG. 11, the first dielectric 148, the source layer 152, andthe angled structures 102 may be etched to form a second plurality oftrenches 160 and a plurality of vertical structures 162. In exemplaryembodiments, the angled structures 102 and the plurality of verticalstructures 162 extend perpendicular to one another. For example, theplurality of vertical structures 162 may generally extend parallel tothe x-axis, while the plurality of angled structures 102 may generallyextend parallel to the z-axis. In some embodiments, the plurality ofvertical structures 162 may generally extend parallel to theperpendicular 126.

Next, as shown in FIG. 12, a second dielectric 166 may be deposited overthe device 100, for example, using a dielectric fill and lithographypatterning and etch process within the second plurality of trenches 160.The second dielectric 166 may be partially removed to expose the angledstructures 102, which are subsequently covered with a gate dielectric168 (FIG. 13). In some embodiments, the gate dielectric 168 may beformed by a deposition and etch back process. Partially removing thesecond dielectric 166 may include recessing the second dielectric 166within the second plurality of trenches 160 and recessing a portion ofthe second dielectric 166 of the plurality of vertical structures 162 toform a stepped sidewall 170. The stepped sidewall 170 may beneficiallyexpose a side of the tilted angled structures 102 to form a partiallywrapped gate to provide better transistor control.

Next, as shown in FIG. 13, a metal may be deposited over the seconddielectric 166 and the gate dielectric 168 to form a series of wordlines174. In some embodiments, the metal of the wordline 174 may be alow-resistance material, such as tungsten, titanium nitride, titanium,ruthenium, cobalt molybdenum, etc. The metal of the wordlines 174 may bedeposited and then removed (e.g., etched) to a desired height/thickness.As shown, the wordlines 174 may extend partially up the plurality ofvertical structures 162 and partially up the angled structures 102.Furthermore, the wordlines 174 may run parallel to the plurality ofvertical structures 162 and perpendicular to the trenches 104 (notshown).

Next, as shown in FIG. 14, the second dielectric 166 and a portion ofthe gate dielectric 168 may be removed from the device 100 followingformation of the wordlines 174. Once complete, the device 100 may be animproved 4F² DRAM device having bitlines 144 tucked under the tiltedangled structures 102. As shown, the wordlines 174 may run perpendicularto the trenches 104.

Turning now to FIG. 15, a side cross-sectional view of the device 100according to embodiments of the present disclosure will be described ingreater detail. Although not shown, it will be appreciated that spacerfilms may be present on the device 100. As shown, the device 100 mayinclude the plurality of trenches 104 and the plurality of angledstructures 102, wherein each angled structure of the plurality of angledstructures 102 includes the first sidewall 110 opposite the secondsidewall 112. Due to the angle and thickness (e.g., along the x-axis) ofthe plurality of angled structures 102, each second sidewall 112 mayextend over an adjacent trench 104. As shown, each bitline 144 may betucked under the angled structures 102, while the drains 142 can bedoped by a vertical implant 141 and/or a line of sight angled implant178. As further shown, a phosphorous implant 183 may be performed beforeor after fin etching to form wells in the device 100.

The angled structures 102 of the device 100 may be oriented at anon-zero angle of incidence (θ) with respect to the perpendicular 126extending normal to a plane 180 defined by the bottom surface 109 of thetrenches 104. As further shown, each of the plurality of angledstructures 102 includes a source 184 formed in a top portion 186thereof, wherein wordline(s) 174 extend across the angled structures102, for example, along the x-axis.

In view of the foregoing, at least the following advantages are achievedby the embodiments disclosed herein. A first advantage is theelimination or reduction in hole accumulation into the body of thedevice due to the floating body effect, by providing a path for theholes. A second advantage is the reduction of off-leakage current, e.g.,for vertical channel transistors.

In various embodiments, design tools can be provided and configured tocreate the datasets used to pattern the semiconductor layers of devices100 and 200, e.g., as described herein. For example, data sets can becreated to generate photomasks used during lithography operations topattern the layers for structures as described herein. Such design toolscan include a collection of one or more modules and can also becomprised of hardware, software or a combination thereof. Thus, forexample, a tool can be a collection of one or more software modules,hardware modules, software/hardware modules or any combination orpermutation thereof. As another example, a tool can be a computingdevice or other appliance running software, or implemented in hardware.

As used herein, a module might be implemented utilizing any form ofhardware, software, or a combination thereof. For example, one or moreprocessors, controllers, ASICs, PLAs, logical components, softwareroutines or other mechanisms might be implemented to make up a module.In implementation, the various modules described herein might beimplemented as discrete modules or the functions and features describedcan be shared in part or in total among one or more modules. In otherwords, as would be apparent to one of ordinary skill in the art afterreading this description, the various features and functionalitydescribed herein may be implemented in any given application and can beimplemented in one or more separate or shared modules in variouscombinations and permutations. Although various features or elements offunctionality may be individually described or claimed as separatemodules, one of ordinary skill in the art will understand these featuresand functionality can be shared among one or more common software andhardware elements.

The term “substrate” as used herein is intended to include asemiconductor substrate, a semiconductor epitaxial layer deposited orotherwise formed on a semiconductor substrate and/or any other type ofsemiconductor body, and all such structures are contemplated as fallingwithin the scope of the present embodiments. For example, thesemiconductor substrate may comprise a semiconductor wafer (e.g.,silicon, SiGe, or an SOI wafer) or one or more die on a wafer, and anyepitaxial layers or other type semiconductor layers formed there over orassociated therewith. A portion or entire semiconductor substrate may beamorphous, polycrystalline, or single-crystalline. In addition to theaforementioned types of substrates, the semiconductor substrate employedin the present embodiments may also comprise a hybrid oriented (HOT)semiconductor substrate having surface regions of differentcrystallographic orientation. The semiconductor substrate may be doped,undoped, or contain doped regions and undoped regions therein. Thesemiconductor substrate may contain regions with strain and regionswithout strain therein, or contain regions of tensile strain andcompressive strain.

For the sake of convenience and clarity, terms such as “top,” “bottom,”“upper,” “lower,” “vertical,” “horizontal,” “lateral,” and“longitudinal” will be used herein to describe the relative placementand orientation of components and their constituent parts as appearingin the figures. The terminology will include the words specificallymentioned, derivatives thereof, and words of similar import.

The use of “including,” “comprising,” or “having” and variations thereofherein is meant to encompass the items listed thereafter and equivalentsthereof as well as additional items. Accordingly, the terms “including,”“comprising,” or “having” and variations thereof are open-endedexpressions and can be used interchangeably herein.

The phrases “at least one”, “one or more”, and “and/or”, as used herein,are open-ended expressions that are both conjunctive and disjunctive inoperation. For example, each of the expressions “at least one of A, Band C”, “at least one of A, B, or C”, “one or more of A, B, and C”, “oneor more of A, B, or C” and “A, B, and/or C” means A alone, B alone, Calone, A and B together, A and C together, B and C together, or A, B andC together.

All directional references (e.g., proximal, distal, upper, lower,upward, downward, left, right, lateral, longitudinal, front, back, top,bottom, above, below, vertical, horizontal, radial, axial, clockwise,and counterclockwise) are only used for identification purposes to aidthe reader's understanding of the present disclosure, and do not createlimitations, particularly as to the position, orientation, or use ofthis disclosure. Connection references (e.g., attached, coupled,connected, and joined) are to be construed broadly and may includeintermediate members between a collection of elements and relativemovement between elements unless otherwise indicated. As such,connection references do not necessarily infer that two elements aredirectly connected and in fixed relation to each other.

As used herein, an element or operation recited in the singular andproceeded with the word “a” or “an” is to be understood as includingplural elements or operations, until such exclusion is explicitlyrecited. Furthermore, references to “one embodiment” of the presentdisclosure are not intended as limiting. Additional embodiments may alsoincorporate the recited features.

Furthermore, the terms “substantial” or “substantially,” as well as theterms “approximate” or “approximately,” can be used interchangeably insome embodiments, and can be described using any relative measuresacceptable by one of ordinary skill in the art. For example, these termscan serve as a comparison to a reference parameter, to indicate adeviation capable of providing the intended function. Althoughnon-limiting, the deviation from the reference parameter can be, forexample, in an amount of less than 1%, less than 3%, less than 5%, lessthan 10%, less than 15%, less than 20%, and so on.

Still furthermore, one of ordinary skill will understand when an elementsuch as a layer, region, or substrate is referred to as being formed on,deposited on, or disposed “on,” “over” or “atop” another element, theelement can be directly on the other element or intervening elements mayalso be present. In contrast, when an element is referred to as being“directly on,” “directly over” or “directly atop” another element, nointervening elements are present.

As used herein, “depositing” and/or “deposited” may include any nowknown or later developed techniques appropriate for the material to bedeposited including but not limited to, for example: chemical vapordeposition (CVD), low-pressure CVD (LPCVD), plasma-enhanced CVD (PECVD),semi-atmosphere CVD (SACVD) and high density plasma CVD (HDPCVD), rapidthermal CVD (RTCVD), ultra-high vacuum CVD (UHVCVD), limited reactionprocessing CVD (LRPCVD), metal-organic CVD (MOCVD), sputteringdeposition, ion beam deposition, electron beam deposition, laserassisted deposition, thermal oxidation, thermal nitridation, spin-onmethods, physical vapor deposition (PVD), atomic layer deposition (ALD),chemical oxidation, molecular beam epitaxy (MBE), plating, evaporation.

While certain embodiments of the disclosure have been described herein,the disclosure is not limited thereto, as the disclosure is as broad inscope as the art will allow and the specification may be read likewise.Therefore, the above description is not to be construed as limiting.Instead, the above description is merely as exemplifications ofparticular embodiments. Those skilled in the art will envision othermodifications within the scope and spirit of the claims appended hereto.

What is claimed is:
 1. A method, comprising: etching a substrate to forma plurality of trenches and a plurality of angled structures, whereineach angled structure of the plurality of angled structures includes afirst sidewall opposite a second sidewall, and wherein the secondsidewall extends over an adjacent trench of the plurality of trenches;forming a spacer along a bottom surface of the plurality of trenches,along the second sidewall, and along the first sidewall, wherein thespacer has an opening at a bottom portion of the first sidewall; forminga drain in each of the plurality of angled structures by performing anion implant to the substrate, wherein the ion implant impacts the firstsidewall through the opening at the bottom portion of the firstsidewall; removing the spacer from the first sidewall; forming a bitlineover the spacer along the bottom surface of each of the plurality oftrenches; and forming a series of wordlines along the plurality ofangled structures.
 2. The method of claim 1, further comprising: forminga dielectric over the bitline within each trench; performing a secondion implant to form a source atop each of the plurality of angledstructures; and etching the dielectric and the plurality of angledstructures to form a second plurality of trenches and a plurality ofstructures, wherein the plurality of trenches and the second pluralityof trenches extend in different directions.
 3. The method of claim 2,further comprising: forming a second dielectric within the secondplurality of trenches; partially removing the second dielectric toexpose the plurality of angled structures; forming a gate dielectricalong the plurality of angled structures; and depositing a wordlinemetal over the second dielectric and the gate dielectric.
 4. The methodof claim 3, further comprising removing the second dielectric and aportion of the gate dielectric after deposition of the wordline metal.5. The method according claim 3, wherein partially removing the seconddielectric comprises recessing the second dielectric within the secondplurality of trenches and recessing a portion of the second dielectricof the plurality of structures.
 6. The method of claim 1, whereinperforming the ion implant to the substrate comprises implanting thesubstrate at a non-zero angle of incidence with respect to aperpendicular extending from a plane defined by the bottom surface ofeach of the plurality of trenches.
 7. The method according to claim 1,further comprising forming a dielectric layer over the bottom surface ofeach of the plurality of trenches, wherein the spacer is formed over thefirst and second sidewalls following formation of the dielectric layer.8. The method according to claim 7, forming the spacer comprising:conformally forming a spacer layer over the bottom surface of each ofthe plurality of trenches, the second sidewalls, and the firstsidewalls; etching the spacer layer to remove the spacer layer from thefirst sidewalls, wherein the spacer layer remains along the bottomsurface of each of the plurality of trenches and along the secondsidewalls; forming the dielectric layer over the bottom surface of eachof the plurality of trenches, wherein the dielectric layer extendspartially up the first sidewalls; and forming a second spacer layer overthe first sidewalls and the second sidewalls.
 9. The method according toclaim 8, further comprising removing the dielectric layer to form theopening at the bottom portion of the first sidewall.
 10. A dynamicrandom-access memory (DRAM) device, comprising: a substrate including aplurality of trenches and a plurality of angled structures, wherein eachangled structure of the plurality of angled structures includes a firstsidewall opposite a second sidewall, and wherein the second sidewallextends over an adjacent trench of the plurality of trenches; a drain ineach of the plurality of angled structures; a bitline over a spaceralong a bottom surface of each of the plurality of trenches, wherein thesecond sidewall extends over the bitline; and a series of wordlinesalong the plurality of angled structures.
 11. The DRAM device of claim10, the plurality of angled structures oriented at a non-zero angle ofincidence with respect to a perpendicular extending from a plane definedby the bottom surface of each of the plurality of trenches.
 12. The DRAMdevice of claim 10, further comprising a source atop each of theplurality of angled structures.
 13. The DRAM device of claim 10, furthercomprising a gate dielectric over the plurality of angled structures.14. The DRAM device of claim 10, wherein the series of wordlines runperpendicular to the plurality of trenches.
 15. A method of forming adynamic random-access memory (DRAM) device, comprising: etching asubstrate to form a plurality of trenches and a plurality of angledstructures, wherein each angled structure of the plurality of angledstructures includes a first sidewall opposite a second sidewall, andwherein the second sidewall extends over an adjacent trench of theplurality of trenches; forming a spacer along a bottom surface of eachof the plurality of trenches and along the first and second sidewalls ofeach of the plurality of angled structures, wherein the spacer has anopening at a bottom portion of the first sidewalls; forming a drain ineach of the plurality of angled structures by performing an ion implantto the substrate, wherein the ion implant impacts the first sidewallsthrough the opening at the bottom portion of the first sidewalls;removing the spacer from the first sidewalls, wherein the spacer remainsalong the bottom surface of each of the plurality of trenches and alongthe second sidewalls; forming a bitline over the spacer along the bottomsurface of each of the plurality of trenches, wherein the secondsidewalls extend over the bitlines; forming a source atop each of theplurality of angled structures by performing a second implant to theplurality of angled structures; and forming a series of wordlines alongthe plurality of angled structures.
 16. The method of claim 15, furthercomprising: forming a dielectric over the bitline within each trench ofthe plurality of trenches; performing a second ion implant to thedielectric and to the plurality of angled structures to form the sourceatop each of the plurality of angled structures; and etching thedielectric and the plurality of angled structures to form a secondplurality of trenches and a plurality of vertical structures, whereinthe plurality of trenches and the second plurality of trenches extendperpendicular to one another.
 17. The method of claim 16, furthercomprising: forming a second dielectric within the second plurality oftrenches; partially removing the second dielectric to expose theplurality of angled structures; forming a gate dielectric along theplurality of angled structures; depositing a wordline metal over thesecond dielectric and the gate dielectric; and removing the seconddielectric and a portion of the gate dielectric after deposition of thewordline metal.
 18. The method according to claim 15, further comprisingforming a dielectric layer over the bottom surface of each of theplurality of trenches, wherein the spacer is formed over the first andsecond sidewalls of the plurality of angled structures followingformation of the dielectric layer.
 19. The method according to claim 18,forming the spacer comprising: conformally forming a spacer layer overthe bottom surface of each of the plurality of trenches and along thefirst and second sidewalls of each of the plurality of angledstructures; etching the spacer layer to remove the spacer layer from thefirst sidewalls, wherein the spacer layer remains along the bottomsurface of each of the plurality of trenches and along the secondsidewalls; forming the dielectric layer over the bottom surface of eachof the plurality of trenches, wherein the dielectric layer extendspartially up the first sidewalls; and forming a second spacer layer overthe first sidewalls and the second sidewalls.
 20. The method accordingto claim 19, further comprising removing the dielectric layer to formthe opening at the bottom portion of the first sidewall.